MOSFETs save space in DC end applications
Infineon has launched a family of StrongIRFET MOSFETs for DC powered circuits including battery powered circuits, brushed and BDLC motor drives. The MOSFETs offer efficiency for end applications such as power and gardening tools, light EVs, UAVs and e-bikes that demand a high level of energy efficiency but are restricted in available space. This is made possible by the compact Medium Can DirectFET housing featuring a revised layout.
The StrongIRFET devices are housed in a Medium Can DirectFET package that features dual-sided cooling to deliver high power density and excellent thermal performance. By re-locating the gate pad to the corner of the die on these latest devices, the layout significantly increases the source contact area to achieve even lower thermal resistance to the PCB than standard DirectFETpackages, further improving efficiency, and increasing the scalability of design.
The devices, which range from 40 to 75V, feature the characteristics of the StrongIRFET family, including low RDS(ON) to minimise conduction losses , high current carrying capability and rugged silicon to improve system reliability. The product family features an environmentally-friendly 100% lead-free package that iscurrent and future ROHS compliant.
“The reliability and performance of DirectFET packaging technology is further enhanced with a new layout that now offers even lower thermal resistance,” said Stephane Ernoux, Product Marketing, Power Management and Multimarket Division, Infineon Technologies. “Combined with rugged silicon, these StrongIRFET DirectFET MOSFETs offer improvements in overall system-level size, efficiency and cost making them well suited to all space constrained applications that require that extra efficiency demanded by the manufacturer and the end-user.”
Production orders are available immediately.