MOSFET, power modules cover circuit configurations
Seven new MOSFET and diode power modules designed specifically for on-board charger applications have been unveiled by Vishay Intertechnology.
Offered in a variety of circuit configurations, the integrated solutions combine high efficiency fast body diode MOSFETs and SiC, FRED Pt, and MOAT diode technologies in the compact EMIPAK 1B package featuring patented PressFit pin locking technology.
These Vishay Semiconductors devices offer all the circuit configurations required for AC/DC, DC/DC, and DC/AC conversion in on-board charging applications — input / output bridges, full-bridge inverters, and power factor correction (PFC) — across a wide range of power ratings.
Compliant with the AQG-324 automotive guideline, the modules can be combined to provide a complete solution for electric (EV) and hybrid electric (HEV) vehicles, in addition to e-scooters, agricultural equipment, railways, and more.
Based on a matrix approach, the devices' EMIPAK package can accommodate a range of custom circuit configurations in the same compact 63 mm by 34 mm by 12 mm footprint.
This enables higher power density than utilising discrete solutions while providing the flexibility to use each module in different power stages for industrial and renewable energy applications, including welding, plasma cutting, UPS, solar inverters, and wind turbines.
The devices' exposed AI2O3 direct bonded copper (DBC) substrate provides improved thermal performance, while their optimised layout helps to minimize stray inductance for better EMI performance.
The modules' PressFit pin locking technology allows for easy PCB mounting and reduces mechanical stress on the substrate, while their baseless structure increases reliability by reducing the number of solder interfaces.