Under this agreement, Mitsubishi Electric will market its latest generation power chips of various ratings (current range: 15A – 200A, voltage class: 600V & 1200V) in the Smart-1,-2 &-3 housings of Infineon Technologies. Infineon Technologies, the creator of the new SmartPACK/PIM module concept, will continue to manufacture and supply the same range of fully compatible products using its own chip technologies and module manufacturing.
Users of SmartPACK/-PIM will now benefit from a new cooperation of two worldwide leading IGBT module manufactures.