“The demand for higher performance continues to increase in many applications such as camera modules or solid state drives, while the form factors stay the same or continue to diminish. This means that designers have less space to fit all the components in these products,” noted Brian Hedayati, vice president of marketing for high performance linear and power solutions at Micrel. “Micrel’s ultra-compact, low-profile power module solutions are ideal for these space-constrained applications and where busy designers need to complete multiple projects with short design cycle times while addressing EMI issues during the critical development phase. Micrel’s power modules meet the exacting EN55022 class B EMI standard which eliminates the EMI concerns while providing a fast turnkey solution that can be used in multiple designs.”
In addition to offering high efficiency and a small form factor, these modules are fully protected against overcurrent, overvoltage, and thermal faults. Additional features include adjustable soft-start for controlling in-rush current, an automatic output discharge circuit (MIC33164 /MIC33264), and a power good output. The MIC33163/MIC33164 are specified for a junction temperature from -40-degC to +125-degC while the MIC33263/MIC33264 are specified from -40-degC to +85-degC.