The new power module comes with a single thermal pad to optimise heat transfer, enabling engineers to simplify board mounting and layout.
The TPSM53604 can operate in ambient temperatures as high as 105°C to support rugged applications in factory automation and control, grid infrastructure, test and measurement, industrial transport, and aerospace and defence.
By pairing the TPSM53604 with a compact step-down module such as the TPSM82813 and TPSM82810, engineers can create a complete power solution from a 24V input down to the point of load, while minimising design time and effort.
Key benefits and features:
- Shrink and simplify the power solution: Its total area of 85mm2 for a single-sided layout is the smallest solution for common 24V, four amps industrial applications. The standard QFN footprint helps simplify design and thereby reduce time to market.
- Efficiently dissipate heat at high ambient temperatures: Forty-two percent of the TPSM53604’s QFN package footprint touches the board, enabling more efficient heat transfer compared to competing ball-grid-array (BGA) packages. In addition, the module’s buck converter integrates MOSFETs with low drain-source on resistance (RDS(on)) to enable conversion efficiency of 90% at 24V to five volts. Watch the video, ‘Enhancing power supply performance with the TPSM53604 power module’, for more details.
- Easily meet EMI standards: The TPSM53604’s integrated high-frequency bypass capacitors and lack of bond wires help engineers meet the electromagnetic interference (EMI) standard defined by CISPR (Comité International Spécial des Perturbations Radioélectriques) 11 Class B limits.
The TPSM53604 is now available from TI and authorized distributors in a 5×5.5mm QFN package. Pricing starts at $3.65 in 1,000-unit quantities.
Production quantities of the TPSM53602 (two amps) and TPSM53603 (three amps) modules are also now available from TI and authorised distributors. Pricing starts at $2.64 and $3.21 in 1,000-unit quantities, respectively.