Low profile QFN-package power module announced

15th October 2019
Lanna Deamer


RECOM’s latest addition to its DC/DC converter portfolio is one of the smallest in its class of low profile QFN-packaged buck regulator power modules. According to the company, the RPX-2.5 module is exceptional due to its flip-chip technology which increases power density and improves thermal management.

RECOM’s new power module offers a high power density footprint on a 4.5x4x2mm thermally-enhanced QFN package.

The RPX-2.5 provides an input range from 4.5 to 28VDC, allowing 5, 12 or 24V supply voltages to be used. The output voltage can be set with two resistors in the range from 1.2 up to 6V. The maximum output current is 2.5A, and the output is fully protected against continuous short circuits, output overcurrent, or over-temperature faults.

It has an efficiency of up to 92%, and it is thermally optimised due to its flip-chip technology. An integrated shielded inductor in this miniature package makes it optimal for space-constrained applications.

To facilitate rapid testing, RECOM also offers an evaluation board for this product so that customers will be able to quickly and easily test.

Converter samples, evaluation boards, and OEM pricing are available from all authorised distributors or directly from RECOM.

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