KPS utilises a proprietary lead-frame technology to vertically stack one or two MLCCs in a parallel circuit configuration in a single compact surface mount package. The attached lead-frame mechanically isolates the capacitors from the printed circuit board, offering advanced mechanical and thermal stress performance. Isolation also addresses concerns for audible, microphonic noise that may occur when a bias voltage is applied.
A two-chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount MLCC devices. Typical applications include smoothing circuits, DC/DC converters, power supplies, and noise reduction circuits with a direct battery or power source connection. KPS “L” capacitors are also ideal for any application that is subject to high levels of board flexure or temperature cycling.