IR’s Automotive-Qualified IGBT with Solderable Front Metal Delivers Improved Thermal Performance and Higher Reliability

The AUIRG7CH80K6B-M utilizes IR’s latest-generation field stop trench technology to significantly reduce conduction and switching losses. Additionally, the new device’s solderable front metal (SFM) allows dual-sided cooling to improve thermal performance, and enables wire bonds to be eliminated to achieve higher reliability.

“Traditionally, wire bonds are potentially a source of failure in automotive inverter modules. The AUIRG7CH80K6B-M with its solderable front metal allows the use of wire bond-less packaging techniques that together with the dual-sided cooling feature, provides improved thermal performance, higher efficiency and extends the reliability of inverter modules,” said Fabio Necco, product marketing manager, IR Automotive Business Unit.

Other key performance benefits include square reverse bias safe operating area (RBSOA), up to 175°C maximum operating temperature, high peak turn-off capability, positive VCE(on) temperature co-efficient and short-circuit rating of 6 microseconds. The AUIRG7CH80K6B-M is available in die-form only.

The device is qualified according to automotive standards and is part of IR’s automotive quality initiative targeting zero defects.