“With the introduction of the TSJ concept, we are significantly expanding the technological capabilities of silicon carbide,” said Peter Wawer, President of Infineon’s Green Industrial Power Division. “The combination of trench and superjunction technology enables higher efficiency and more compact designs – an important step for applications requiring the highest levels of performance and reliability.”
Infineon is committed to gradually expanding its CoolSiC product portfolio, leveraging SiC TSJ technology. This expansion will encompass a diverse range of package types, including discretes, moulded and frame-based modules, as well as bare dies. The extended portfolio will cater to a broad spectrum of applications, targeting both the automotive and industrial sectors.
The first products based on the new technology will be 1200V in Infineon ID-PAK for automotive traction inverters and combine the advantages of trench technology and superjunction design. This scalable package platform supports power levels of up to 800kW, enabling a high degree of system flexibility. Key benefits of the technology include increased power density, achieved through an up to 40% improvement in R DS(on)*A, allowing for more compact designs within a given power class. Additionally, the 1200V SiC trench-superjunction concept in ID-PAK enables up to 25% higher current capability in main inverters without compromising short-circuit capability.
This advancement also results in enhanced overall system performance, delivering improved energy efficiency, reduced cooling requirements, and higher reliability for demanding automotive and industrial applications. Moreover, the system benefits from reduced parallelisation requirements, which simplify the design process and lower overall system costs. With these innovations, the Infineon ID-PAK package equipped with SiC TSJ technology contributes to the development of more efficient and cost-effective traction inverter designs for automotive applications.
“As the global number one in automotive semiconductors, Infineon sets the pace of innovation and helps build the bridge between technological progress of vehicles and sustainable mobility,” said Peter Schiefer, President of Infineon’s Automotive Division. “Our new trench-based SiC superjunction technology brings further value to electric vehicle drivetrains enabling higher efficiency and system design simplicity.”
As an early customer, Hyundai Motor Company development teams will engage with Infineon’s trench-superjunction technology, leveraging its benefits to enhance their EV offerings. This partnership is expected to drive the development of more efficient and compact EV drivetrains.
Availability
Initial ID-PAK 1200V samples are now available for selected automotive drivetrain customers. The SiC TSJ-based ID-PAK 1200V package is expected to be ready for volume production in 2027.
