They have been optimised especially for applications where parallel connection is necessary and have the lowest possible on-resistance RDS(on) on a 5 x 6 mm PCB area. The OptiMOS family also features significantly reduced package parasitics and excellent thermal performance. The transistors are RoHS-compliant and available in reel packaging at www.rutronik24.com.
The main feature of the source-down package concept is the orientation of the active side of the silicon chip to the bottom of the component. Combined with the reinforced clip on the top of the silicon chip, package parasitics are significantly reduced while thermal performance is taken to the next level. State-of-the-art silicon technology with excellent FOM and maximised chip/package ratio increases current capability and ensures minimised power losses. Infineon’s OptiMOS power MOSFETs enable fast switching and reduce the need for parallel switching of components.
Key functions at a glance
- Minimised line losses
- Reduced voltage overshoots
- Increased maximum current carrying capacity
- Fast switching
- Less parallel connection of components required
Examples of applications
- Robotics
- Solar
- Telecommunications
- Low voltage drives
- Light electric vehicles
- Drones
- Electric tools
- Battery Management System
- Class D audio applications USB chargers
