Indium Corporation materials for power electronics at PCIM

26th April 2023
Harry Fowle

Indium Corporation will proudly showcase a selection of innovative products at PCIM Europe, 9th-11th May in Nuremberg, Germany.

Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.

Featured products include:

  • InTACK – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the dependency on tooling without compromising soldering or sintering quality.
  • InFORMS – reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bond-line thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher-performance modules.
  • Indalloy 301 LT Alloy for Preforms/InFORMS – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS.
  • InFORCE 29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, and die-attach applications, InFORCE 29 features high workability, making it suitable for printing or dispensing applications. InFORCE 29 provides excellent sinter performance on bare copper surfaces without the need for costly gold or silver plating.
  • InFORCE MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, and die-attach applications, InFORCE MF is specially formulated for printing applications providing low process yield loss due to print defects and reducing the need for overprint. With a high metal load and low organic content, it enables fast drying times and less material loss.
  • Durafuse HT – based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #460.

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