GaN in plastic module is optimised for avionics

Supporting SMT assembly, the modules provide significant cost and process advantages compared to ceramic-packaged flange-mount components. Delivering clear benefits in SWaP while enabling high volume manufacturing efficiency, MACOM’s GaN power modules feature a LGA pattern for enhanced thermal flow and do not require copper coining or complicated thermal management techniques on the system PC board.

Under pulsed conditions, these modules deliver output power greater than 90W, with 30 dB a typical associated power gain and 60% typical power added efficiency. Supporting 50V operation and up to 3ms pulse width/duration for improved signal flexibility, the GaN in Plastic power modules reduce overall power consumption and cooling requirements compared to existing options.

“The 90 W Avionics module is the latest GaN Module in MACOM’s growing family of fully matched SMT power products,” said Paul Beasly, Product Manager, MACOM. “The ease of application, system benefits and surface-mount automated assembly are of great benefit to the customer, and critically, also improve the time to market for rapidly evolving requirements in aviation and radar applications.”