Designed specifically for Li-Ion battery pack protection circuits and other ultraportable applications, the FDMB2307NZ features dual N-channel common drain MOSFETs, enabling bidirectional current flow.
By using advanced PowerTrench processes, the FDMB2307NZ provides high power density and a maximum Rss(on) of 16.5mΩ at VGS = 4.5V, ID = 8A, resulting in lower conduction losses, lower voltage drop, less power dissipation and increased overall design efficiency when compared to competitive solutions. The FDMB2307NZ also provides excellent thermal performance, resulting in cooler system operation, further increasing efficiency.
The device’s 2x3mm2MicroFET™ package provides designers with one of the smallest MLP solutions available – 40 percent smaller than existing legacy solutions – saving significant board space in their design. RoHS-compliant, the device also provides HBM ESD protection >2kV.
By integrating leading circuit technologies into tiny, advanced packages, Fairchild Semiconductor provides mobile users significant advantages while reducing the size, cost and power of designs. Fairchild’s mobile IP can be found in a majority of mobile devices in use today.