This P-Channel MOSFET is fabricated with Fairchild’s advanced-performance PowerTrench® MOSFET process technology, making it possible to achieve lower RDS(ON) and higher load currents in smaller package sizes. The WL-CSP package features 6 x 300µm Pb-free solder balls for the board connection, providing excellent electrical and thermal resistance values compared to other WL-CSP pin outs. It features a low package height of only 0.65mm when mounted, facilitating slimmer designs.
The FDZ197PZ is part of a comprehensive portfolio of advanced MOSFETs and answers the industry’s need for compact, low-profile, high performance MOSFETs for charging, load switching, DC-DC and boost applications.