The FDZ371PZ’s WL-CSP package utilizes 4 x 250µm lead-free solder balls, providing excellent electrical and thermal resistance values. Package height, when mounted, is an industry-leading 0.4mm.
The FDZ371PZ is part of a comprehensive portfolio of advanced MOSFETs that answer the industry’s need for compact, low-profile MOSFETs, offering high efficiency and excellent switching performance.