“Fairchild continues to innovate its product offering by providing leading SPM® power module solutions,” said Taehoon Kim, vice president of Fairchild’s Functional Power Solutions. “We have integrated three bootstrap diodes with bootstrap resistor characteristics into currently available SPM modules to make a simpler and smaller board design possible, eliminating six additional external components. These modules feature NPT IGBTs that provide optimal trade-offs between conduction losses and switching losses and high guaranteed junction temperature to improve system efficiency and reliability. Fairchild’s Motion-SPM power modules are ideal solutions for energy- and cost-restricted motor applications.”
These highly integrated devices utilize full molded or Direct Bonded Copper (DBC)-based package technology. A Motion-SPM product’s innovative DBC-based Mini-DIP package provides extremely low thermal resistance (FSBB30CH60B (600V/30A): Rth(j-c), IGBT = 1.17°C/W).
These Motion-SPM products utilize lead-free (Pb-free) terminals and have been characterized for moisture sensitivity in accordance with the Pb-free reflow requirements of the joint IPC/JEDEC standard J-STD-020. All of Fairchild’s products are designed to meet the requirements of the European Union’s Directive on the restriction of the use of certain substances (RoHS).