Compact 8:1 IBC enhances AI data centre efficiency

Delivering up to 1.2kW peak power with a peak efficiency of 97.8%, the BMR323 achieves over 60% more power than its predecessor, the BMR320, while maintaining footprint compatibility. This allows existing designs to be easily upgraded, providing a way to meet rising continuous and peak power requirements with minimal redesign.

Engineered for high power density and cost-effective implementation, the BMR323 provides 600W continuous output power. Up to six units can be paralleled for a total output of up to 3.6kW, with active current sharing ensuring efficient load distribution and system stability.

“The BMR323 combines outstanding efficiency with high peak power capability up to 7.2 kW with six units in parallel and the low output voltage enables high 2nd step converter efficiency. Backed by Flex Power Modules’ proven high standards for testing and qualification, it offers a reliable, high-performance solution for next-generation data centre designs,” said Olle Hellgren, Director, Product Management and Marketing, Flex Power Modules.

The module operates from a 40-60V input and delivers an unregulated 5-7.5V output, housed in a compact 27.0 x 18.0 x 6.7mm (1.06 x 0.71 x 0.26”) package, making it ideal for space-constrained designs.

The BMR323 is compatible with Flex Power Designer, a software tool providing configuration, performance simulation, and monitoring features via a PMBus interface. The software is downloadable for free at  flex power designer.

A high-efficiency hybrid switching capacitor (HSC) topology combined with an open-frame design improves thermal performance, enabling better cooling and higher output power. The module is optimised for operation with a heatsink mounted on top of the device, but there is flexibility for other cooling methods to be used with the solution, such as direct-to-chip liquid cooling.

The BMR323 also meets the latest IEC/EN/UL 62368-1 safety standards and is fully compatible with Pb-free SMD reflow processes for lead-free manufacturing and high-temperature soldering profiles.