Collaboration on advanced power-on-package solutions

Vicor will provide Power-on-Package current multipliers enabling high density, high current delivery to processors. This collaboration will address the rapid growth of higher performing processors, which has created proportionate growth and complexity in high-speed I/Os and high current consumption demands.

Vicor’s Power-on-Package technology enables current multiplication within the processor package, allowing for higher efficiency, density, and bandwidth. Providing current multiplication within the package can reduce interconnect losses by up to 90%, while allowing processor package pins, typically required for high current delivery, to be reclaimed for expanded I/O functionality.

Vicor’s Power-on-Package solutions were featured at the NVIDIA GPU Technology Conference 2018 and China ODCC 2018 Summit. The Vicor advanced Power-on-Package technology enables Vertical Power Delivery (VPD) from the bottom side of the processor. VPD virtually eliminates Power Delivery Network (PDN) losses while maximising I/O capability and design flexibility.

Kyocera’s proprietary solutions to optimise processor performance and reliability are based on decades of experience in package, module and motherboard manufacturing for customers worldwide. Kyocera has cultivated design expertise by applying Vicor's Power-on-Package devices in multiple applications.

By utilising its design technology, simulation tools and manufacturing experience, Kyocera provides optimal designs for complex I/O routing, high speed memory routing, and high-current power delivery.

Through collaboration, Kyocera and Vicor aim to bring new solutions for Artificial Intelligence (AI) and high-performance processor applications to market.