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Acquisition leads to semiconductor product expansion

30th January 2018
Alice Matthews
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Technical distributor of equipment and materials to the microelectronic research and manufacturing sectors, Inseto, has acquired IDB Technologies, the supplier of semiconductor wafers and substrates. The two companies have worked closely together for several years and share many of the same customers, who now stand to benefit greatly from the combined resources and technical expertise.

Matt Brown, Director, Inseto, commented: “IDB Technologies worked primarily with universities in the UK and mainland Europe. Many spin-off companies have emerged from these universities and are now scaling for volume production, which is where Inseto can help.”

IDB Technologies’ materials stock and service offerings have added to Inseto’s Consumables Division, which already represents 12 OEMs, including semiconductor assembly materials and machine consumable tooling.

In addition, Ian Burnett, Founder of IDB Technologies, has joined Inseto to provide support to customers. Burnett commented: “This is a win-win for all parties concerned, and especially our customers. Inseto is ISO 9001:2015 certified, has invested in an impressive storage and handling facility and has automated many of its processes to assure as fast a turnaround as possible on all orders.”

Inseto can now supply a wide range of wafers, with next day delivery, from an extensive UK stock, and many other wafers can be provided on short lead-times. The company also processes wafers including oxidised and nitride coating, patterned and diced wafers.

Brown added: “As users’ projects become more complex, and as they scale their manufacturing processes to serve their target markets, it is essential to have a streamlined supply chain plus the ability to call on technical expertise when it comes to specifying materials and equipment.

"Following our acquisition of IDB Technologies, and along with Ian coming on board, Inseto can help users commercialise their products by de-risking manufacturing aspects they are perhaps encountering for the first time.”

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