Designers can stack two converters in parallel to drive loads up to 70 A for processors in space-constrained and power-dense applications in various markets, including wired and wireless communications, enterprise and cloud computing, and data storage systems.
The highly integrated TPS546C23 power converter is 44% denser (amperes per square millimeter) than competitive devices. It features 0.5% reference-voltage accuracy over temperature and full differential remote-voltage sensing to meet the voltage accuracy requirements of deep sub-micron processors.
Current sharing enables the stacking of two converters and high efficiency and excellent thermal performance are delivered via the device’s single-pad, stacked die, quad flat no-lead (QFN) package. Read the blog post, “Stack current with PowerStack packages for higher POL.”
TI also offers the TPS546C20A PMBus converter that supports pin-strapping for both the output voltage and soft-start time. Get more information on TI’s entire portfolio of converters with the PMBus interface.
• Integrated low Rdson power MOSFETs support 35 A of continuous output current.
• On-chip PMBus interface and non-volatile memory simplify power-supply design and enable customisation.
• Output current, output voltage and internal die temperature telemetry supported via PMBus facilitate active power management. Read the blog post, “PMBus – what is the value anyway?”
• Voltage-control mode with clock frequency synchronisation and input feed-forward improves EMI/noise and responds rapidly to input-voltage changes. Frequency synchronisation to an external clock eliminates beat noise and reduces electromagnetic interference (EMI).