ROHM Semiconductor Announce The Industry’s Smallest Zener Diodes

ROHM recently announced the development of the smallest Zener diodes in the industry ideal for high-density mounting in portable devices such as smartphones. Size is reduced by 55% over conventional 0603-size (0.6×0.3mm) products. The ultra-compact form factor (0.4×0.2mm) contributes to increased miniaturization and sophistication in devices requiring greater compactness and minimal thickness, including mobile phones and digital cameras.

In recent years, the increasing sophistication and functionality of smartphones requires a greater number of components, necessitating ultra-compact parts that support high-density mounting to maintain or even decrease overall set size. Although passive products such as resistors and capacitors are already available in the 0402 size, the smallest discrete products, including transistors and diodes, offered until now are in the 0603 size due to the relatively increased complexity.

In October of 2011 ROHM introduced the smallest chip resistors on the market, in the 03015 size, which represented a significant breakthrough. The same proprietary ultra-precision technology was used for diode production, along with an original chip device structure and ultra-fine process technology, resulting in an ultra-compact, ultra-thin form factor that maintains the same electrical characteristics as conventional 0603-size products. ROHM will first offer Zener diodes in the 0402 size, then expand to include Schottky barrier diodes and other diode products.

Samples are available, OEM quantities will be available as of April 2013.

Key Features:
1) Original process technology results in the industry’s smallest package size: 0402 (0.4mmx0.2mm)
2) Dimensional precision improved significantly, from ±20μm to ±10μm
3) Gold electrode surface enhances solder wettability and reliability

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post

ESCO report for UK electronic systems industry and government at NMI Summit

Next Post

Conduction- or Air-cooled 6U VPX SBC supporting 2nd and 3rd generation Intel Core i7 processors