The new 0805 (2012 mm) EIA compliant form factor of the picoSMD device consumes less than half the board space required by previous offerings, and provides a significant advantage in space-constrained board designs.
“The picoSMD035F device’s small size, fast time-to-trip, and low power dissipation make it a logical and innovative solution for high density circuit board designs,” said Global Product Marketing Manager, Ashfaque Ameen.
Rated at 6V, the picoSMD035F device provides a hold current of 0.35A, a trip current of 0.75A and a maximum resistance of 1.4Ω. The device meets safety agency standards, is full-edge terminated with nickel-gold finish for superior solderability, and is RoHS compliant. Production quantities are now available in tape and reel packages.