TriQuint Introduces TRITIUM Duo, Smallest Dual-Band Power Amplifier Solution for 3G and 4G Smartphones
Vishay Intertechnology’s New TANTAMOUNT Surface-Mount Molded Tantalum Chip Capacitors Offer Industry-Best Low DCL of 0.005 CV in Five Standard Case Sizes
TI introduces industry’s first family of ICs designed to support Thunderbolt Technology

Vishay Intertechnology’s New TANTAMOUNT Surface-Mount Molded Tantalum Chip Capacitors Offer Industry-Best Low DCL of 0.005 CV in Five Standard Case Sizes

Vishay Intertechnology, Inc. today introduced the new TL3 series of TANTAMOUNT surface-mount tantalum molded chip capacitors, the industry’s first such devices to offer DC leakage current (DCL) as low as 0.005 CV, a capability that enables system designers to extend battery run-time in portable devices.

Offered with a wide range of capacitance and voltage values, devices in the TL3 series are optimized for a wide variety of demanding applications that require long product life, such as battery-operated equipment, portable instrumentation, tire-pressure monitoring, medical instruments, local power supplies, hand-held Instruments, and battery backup supplies.

The TL3 capacitors are offered in a molded package in five standard EIA-535BAAC case codes — A, B, C, D, and E — with standard and low ESR options. The devices offer a capacitance range from 0.1 µF to 470 µF over voltage ratings from 4 VDC to 63 VDC, with capacitance tolerances of ± 10 % and ± 20 %. Case codes B, C, D, and E are 100 % surge current tested and offering improved reliability of 0.5% / 1,000 hours. The devices are available with RoHS-compliant tin terminations and halogen-free.

Samples and production quantities of the new TL3 series are available now, with lead times of eight weeks for larger orders.

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post

TriQuint Introduces TRITIUM Duo, Smallest Dual-Band Power Amplifier Solution for 3G and 4G Smartphones

Next Post

TI introduces industry’s first family of ICs designed to support Thunderbolt Technology