Consisting of two resistors integrated into a single 2512 case size, the space-saving devices released today offer a wide resistance range from 10kΩ to 75MΩ, with maximum resistance ratios to 700:1 and tolerances down to ±0.5%. The chip dividers feature temperature coefficients of ±100ppm/°C and typical TCR tracking of ±50ppm/°C.
For design flexibility, CDMV series devices are available with solderable, epoxy-bondable, and wire-bondable terminations in three-sided wraparound or top-only flip chip configurations. Solder-coated nickel barrier terminations are standard for the RoHS-compliant, halogen-free chip dividers, with gold, palladium silver, platinum gold, platinum silver, and platinum palladium gold terminations available.
Samples and production quantities of the CDMV series devices are available now, with lead times of nominally eight to 10 weeks.