The glass-encapsulated DG series provides designers with faster, more accurate, and less expensive alternatives to thermocouples and RTD probes.
DG series devices are free from limitations due to solder temperature, which enables them to offer users a wide operating temperature range of -40°C to +300°C.
With diameters of only 1.5mm, the devices boast a small size that allows for encapsulation in a variety of housings, such as ring lugs and hex nuts.
DG series thermistors are available in four resistance values at 25°C — 10kΩ, 40kΩ, 50kΩ, and 100kΩ — with resistance tolerances down to ±2%, a dissipation constant of >0.5mW/°C, and thermal time constant of <6.5s.
The devices provide temperature coefficient of resistance of -3.9%/°C, -4.40 %/°C, and -4.75%/°C; beta values of 3500°K, 3950°K, and 4200°K; and 32 AWG dumet wire leads.
Samples and production quantities of the devices are available now, with factory lead times of six to eight weeks.