Tantalum capacitor designed for use in wide range of electronics

3rd April 2019
Lanna Cooper


AVX has extended its TACmicrochip Series with the lowest profile 3216-footprint tantalum capacitor currently available on the market. Measuring just 0.5mm high, the first new 'I' case capacitor (EIA Metric 3216-05) is rated for 10μF and 6.3V, but will be followed by future code releases to further extend the offering.

The full line of TACmicrochip capacitors, which has also offered the lowest-profile 1206-06 tantalum capacitors since early 2015, is currently available in 11 case sizes with footprints spanning 1005 to 3528, heights ranging from 0.5-1.5mm, capacitance values spanning 0.10-150μF, and voltage ratings spanning 2-25V.

In addition to exhibiting high capacitance in an extremely low profile package designed to contribute to overall space and weight reductions in end products, the new 3216-05 'I' case TACmicrochip capacitors also deliver all of the standard benefits of tantalum technology, including: inherent immunity to piezoelectric noise and higher stability, reliability, and temperature performance than comparable MLCCs.

Capable of being embedded in 0.8mm-thick PCBs or designed into the latest generation of extremely thin handheld devices, TACmicrochip capacitors are suitable for use in a wide variety of medical applications, including hearing aids and other non-life-support devices, as well as in audio and power amplifier modules, embedded electronics applications, including Near Field Communication (NFC) systems and smart cards, and as coupling/decoupling capacitors in industrial, handheld, and wearable electronics.

“Market demand for smaller and lighter electronic products remains consistent and, despite regular component innovation and the on-chip integration of many components, also remains challenging for design engineers,” said Mitch Weaver, a member of the technical staff at AVX.

“Discrete passive components still occupy a majority of board space in PCB designs, so we are now penetrating the PCB with a new generation of embeddable components, like our new 3216-05 TACmicrochip capacitor, that allow engineers to reliably achieve the small, thin, mechanically robust, and electrically stable designs that next-generation applications demands.”

Manufactured using a tantalum wafer process to achieve the high levels of mechanical tolerance required for ultra miniature devices, TACmicrochip capacitors feature an enhanced internal construction that eliminates the space-consuming elements of conventional molded J-leaded tantalum capacitors, including the anode wire, lead frame, and the need for larger wall thicknesses.

Rated for use in temperatures spanning -55°C to +125°C, the series is generally supplied with tin over nickel terminations, but gold over nickel options are available as well.

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