The power resistor boasts extremely low thermal resistances in each axis to achieve maximum heat dissipation. By conducting heat from the resistive element through low thermal impedance metallic pathways to the package surfaces, the board efficiently channels heat away from the resistor to the ambient. This allows designers to create a product that can operate at higher output power levels, short term overloads & pulse durabilities without the normal thermal problems
The SMP series is suitable for a variety of applications, including high frequency emitter resistors in switching power supplies, high precision CRT colour video amplifiers, high frequency snubber and pulse handling circuits, pulse generator load resistors and in-rush current protection, as well as bleeder resistors.
The series offers tolerances of +/-1% and +/-5% and an operating temperature range of -55°C to 155°C. Exhibiting a resistance range up to 10k and excellent heat dissipation qualities, it offers designers enhanced power handling capabilities and increased protection from the threat of common overheating problems.
John Mackay, Managing Director of BI Technologies said: “As the popularity of surface-mount technology grows, product designers increasingly find themselves faced with the combined challenge of dissipating power from components, whilst removing the generated heat from the component and circuit board. This latest product will present designers with a product capable of solving these problems whilst offering a high power capability.”