Surface mount capacitors suit high-density power applications

26th April 2021
Mick Elliott

KC-LINK with KONNEKT technology surface mount capacitors from KEMET are designed for high-efficiency and high-density power applications.

They are in stock at distributor Digi-Key Electronics.

KONNEKT technology uses an innovative transient liquid phase sintering (TLPS) material to create a surface mount multi-chip solution for high-density packaging.

By utilising KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well-suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.

KONNEKT technology enables a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature.

With an operating temperature range up to +150°C, these capacitors can be mounted close to fast-switching semiconductors in high-power density applications that require minimal cooling.

KC-LINK with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.

These capacitors can also be mounted in a low-loss orientation to further increase power handling capability. The low-loss orientation lowers effective series resistance (ESR) and effective series inductance (ESL), which increases ripple current handling capability.

The capacitors are rated to Commercial and Automotive Grade (AEC-Q200). They have a low-loss orientation option for higher current handling capability and capacitance offerings ranging from 14 nF to 880 nF.

DC voltage ratings are from 500 V to 2,000 V. The capacitors demonstrate high thermal stability and they are surface-mountable using standard MLCC reflow profiles.

They are RoHS compliant and Pb-free

Other applications are wide bandgap (WBG), silicon carbide (SiC), and gallium nitride (GaN) systems, EV/HEV (drive systems and charging), wireless charging, photovoltaic systems and LLC resonant converters.

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