Process Breakthrough Boosts Capacitance In High-Rel Chips

Fundamental developments in the ‘wet process’ used to screen print the dielectric material, has allowed the company to produce thinner layers than previously. The impact is a significant increase in the maximum feasible capacitance possible for a given voltage. Importantly, it has enabled Syfer to introduce a lower voltage, 10V range for the first time.

Capacitance has more than doubled in most devices in Syfer’s standard multilayer chip capacitor ranges based on the C0G dielectric. A new 10V range is available on the C0G dielectric, with devices ranging from a 0603 device with 3.9nF capacitance to a 560nF part in a 2225 footprint.

In addition, Syfer has introduced an X5R dielectric, in voltages from 10V to 53/65V and packages from 0603 to 2225, typically providing increased capacitance over their X7R counterparts.

A typical device, such as the 0805 footprint 10V part, now features an impressive 680nF capacitance, more than double the 330nF available previously. However, these X5R parts are only specified to 85oC, while the X7R range is qualified up to 125oC.

The key advantage of low fire capacitors over those produced using a high fire process, is reliability. For industry sectors such as medical, automotive, military & aerospace and industrial control, ruggedness and reliability are critical. Typically the low fire process produces a more structurally stable component body, with a higher dielectric constant, a lower volt per micron rating, and reduced capacitance loss.

For added reliability, Syfer offers its Flexicap TM polymer termination option, as an alternative to a standard plated termination. Flexicap accommodates a greater degree of board flex than a conventional termination. To meet the most stringent quality standards, Syfer offers additional testing services.

The new parts, manufactured at Syfer’s Norwich, UK facility, are already available in production volumes, on standard 5 week delivery times. RoHS compliant versions are available.