EUMW 2016: 3D stack technology-based components in the spotlight
A recent addition to the Aspen Electronics portfolio will be featured at European Microwave Week in London (October 4-6). RN2 Technologies specialise in multi-layered circuit design and manufacturing processes using LTCC, HTCC, AlN, and Ferrite material.
With 3 dimensional stack technology and using Ag and Cu to make the electric circuits, they can make a number of passive components, like couplers, terminations and attenuators, and circuits in small chip sizes and substrates up to 6GHz.
The adjoining Aspen Electronics Test & Measurement stand, number 132 will feature a selection of RF & Microwave test products. Aspen experts will be on hand across both stands to help and can advise on configuring systems for customer-specific applications.
Product Spotlight
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Panasonic
Panasonic PhotoMOS® Photovoltaic MOSFET High-Power Drivers
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| Stock: | 3490 |
| Cost: | $3.95 |
