Leveraging patented MAP (multi-array packaging) assembly technology, the capacitors released today provide a 10% improvement in space utilisation compared with similar devices, saving PCB space and enabling the design of smaller and thinner end products, including smartphones, tablets and ultra-thin laptops, in addition to wireless cards, network equipment and audio amplifiers and pre-amplifiers.
In these devices, T58 series capacitors are intended for decoupling, smoothing, filtering, and energy storage applications. The devices offer capacitance from 10 to 330µF, with capacitance tolerance of ± 20%, over voltage ratings from 4 to 25V in the MM (1608-09), M0 (1608-10), W9 (2012-09), A0 (3216-18), AA (3216-18), B0 (3528-10) and BB (3528-20) case codes.
The capacitors feature low impedance, low ESR from 50 to 500mΩ at +25°C and 100kHz and ripple current from 0.224 to 1.30A at 100kHz and they operate over a temperature range of -55 to +105°C with voltage derating above +85°C. The rectangular molded case encapsulation of the T58 series is suitable for high-volume PCB assembly and its special lead (Pb)-free L-shaped facedown terminations offer better contact to the solder pad than traditional facedown-style terminations. RoHS-compliant, halogen-free and Vishay Green, the devices feature a Moisture Sensitivity Level (MSL) of 3 and are available in tape-and-reel packaging per the EIA-481 standard.