Farnell to strengthen rugged connectivity solutions globally News & AnalysisPress Releases 7 October 2026
Sensirion environmental sensors enable advanced air quality monitoring Press ReleasesSensors 7 October 2026
Farnell to strengthen rugged connectivity solutions globally News & AnalysisPress Releases 7 October 2026
Sensirion environmental sensors enable advanced air quality monitoring Press ReleasesSensors 7 October 2026
Darim selects Saft Li-ion batteries to power its PVE – a portable video encoder/streamer for emergency response teams Power 1 February 2010 byNews Desk
AIS Introduces a Mobile Rugged Tablet PC featuring 3G, GPS and LED Sunlight Readable Display Technology for Field Sales Force Automation Applications Communications 1 February 2010 byNews Desk
Lauterbach, Discretix Announce Alliance To Provide Secure Chip Debug Capability Design 1 February 2010 byNews Desk
Cadence Encounter Digital Implementation System 9.1 Addresses Industry Productivity Crisis for Complex System-on-Chip Design Design 1 February 2010 byNews Desk
Anritsu Expands Measurement Capability of Handheld Spectrum Analyzers to Include Signal Analyzer Functions Test & Measurement 1 February 2010 byNews Desk
Anritsu Introduced AM/FM/PM Spectrum Analysis Capability for Spectrum Master and Site Master Analyzers Test & Measurement 1 February 2010 byNews Desk
Vishay’s New PAT Series of AEC-Q200-Qualified Precision Automotive Thin Film Chip Resistors Offers ESD Rating of 2 kV, TCR of ± 25 ppm/°C, and Tolerances to ± 0.1 % Passives 1 February 2010 byNews Desk
Vishay Enhances 101/102 PHR-ST Screw-Terminal Power Aluminum Capacitors With Three Large Case Sizes to 90 mm by 220 mm, and 13-mm Terminals Passives 1 February 2010 byNews Desk
600V Vishay Siliconix Super Junction FET Power MOSFETs Feature 0.190-OHM On-Resistance in TO-220, TO-220F, TO-247, and TO-263 Packages Power 1 February 2010 byNews Desk
Vishay’s New TF3 TANTAMOUN Low-ESR Solid Tantalum Chip Capacitors in Three Molded Case Sizes Feature Built-In Fuse for Safety-Critical Applications Passives 1 February 2010 byNews Desk
Vishay – Power SMD White LEDs in Thermally Enhanced PLCC-4 Package Feature Two Binning Versions, High Luminous Intensity to 3550 mcd, and Thermal Resistance Down to 300 K/W Optoelectronics 1 February 2010 byNews Desk
Vishay – Power SMD White LEDs in Thermally Enhanced PLCC-4 Package Feature Two Binning Versions, High Luminous Intensity to 3550 mcd, and Thermal Resistance Down to 300 K/W Optoelectronics 1 February 2010 byNews Desk
Agilent Introduced Complete Test Solution for PCI Express 3.0 Featuring the New Digital Test Console Test & Measurement 1 February 2010 byNews Desk
Agilent Technologies’ Advanced Design System 2010 to Support Emerging IBIS-AMI Modeling Standard Test & Measurement 1 February 2010 byNews Desk
Agilent Technologies – One-Box Solution for High-Speed Serial Interconnect Analysis Test & Measurement 1 February 2010 byNews Desk
Agilent Technologies’ New LXI Data Acquisition Switch Unit Delivers Instant Easy Connectivity and Use Anywhere Test & Measurement 1 February 2010 byNews Desk
Agilent Technologies, DeMille Research Inc. to Offer CAD Translation, Test Development Tools for Agilent Medalist In-Circuit Testers Test & Measurement 1 February 2010 byNews Desk