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Agilent Technologies Introduces IC-CAP WaferPro Software for Automating Complex Device Modeling Applications Design 20 August 2010 byNews Desk
Agilent Technologies’ Curriculum-Based Teaching Solutions for Electronic Test and Measurement Selected by Multimedia Development Corporation Malaysia Test & Measurement 20 August 2010 byNews Desk
Creative Technology Hong Kong Partners with Future Lighting Solutions to Develop LUXEON-Based LED Downlights for Asia & Europe Optoelectronics 20 August 2010 byNews Desk
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National Instruments UK & Ireland To Present LabVIEW Developer Days Design 20 August 2010 byNews Desk
ATMS given exclusive distribution rights for the Navista range of mobile devices Communications 20 August 2010 byNews Desk
Analog Devices’ Mixed-Signal Front End ICs Reduce Power and PC Board Space in Wireless Communications Equipment Mixed Signal/Analog 20 August 2010 byNews Desk
MAX31782: System management microcontroller cuts power and cooling costs in enterprise equipment Micros 20 August 2010 byNews Desk
ChipWrights Stacks Linux Application Development Kit with Major Enhancements for IPTV Set-Top Boxes and IP Cameras Design 20 August 2010 byNews Desk
Toshiba Electronics announces ultra-compact IC-Coupler for high speed, extended temperature applications requiring reinforced insulation Optoelectronics 20 August 2010 byNews Desk
Toshiba Electronics announces ultra-compact IC-Coupler for high speed, extended temperature applications requiring reinforced insulation Optoelectronics 20 August 2010 byNews Desk
500mA Negative Micropower LDO Offers New High Reliability Grade Operating Down to -55°C Power 20 August 2010 byNews Desk