Products

Industry’s first isolated Analog-to-Digital Converters for AC mains introduced by Silion Labs

• Mixed Signal/Analog

6 June 2012

byNews Desk

3rd generation of Kontron 3U OpenVPX SBCs first to bring 10 Gigabit Ethernet and PCI Express 3.0

• Communications

6 June 2012

byNews Desk

Multitest’s InCarrier Is Now Available In A Wide Range of Loading and Unloading Configurations

• Test & Measurement

6 June 2012

byNews Desk

Cadence Physical Verification System Qualified for TSMC 28nm, 20nm Process

• Design

6 June 2012

byNews Desk

Cadence Encounter and Virtuoso Design Platforms Receive TSMC 20nm Phase I Certification

• Design

6 June 2012

byNews Desk

Cadence Collaborates on 3D-IC Design Infrastructure with TSMC

• Design

6 June 2012

byNews Desk

Samsung and Cadence Deliver 20nm Digital Design Methodology

• Design

6 June 2012

byNews Desk

ROHM Semiconductor Introduces a Broad Line-up of Li-ion Battery Protection ICs

• Power

6 June 2012

byNews Desk

Synopsys and Samsung Deliver a Complete Solution for 20-Nanometer Node

• Design

6 June 2012

byNews Desk

SEHO Systems Introduces the Cost-Effective, Energy-Efficient PowerWave N2

• Renewables

6 June 2012

byNews Desk

PMC introduces industry’s most integrated, lowest power radio transceiver chipset for next-generation macro basestations

• RF / Microwave

6 June 2012

byNews Desk

Posedge standardizes on EnSilica’s eSi-3250 processor for wired/wireless networking IP solutions

• Design

6 June 2012

byNews Desk

TI unveils industry’s first demonstrations of ZigBee Light Link with certified Golden Unit at Computex Taipei

• RF / Microwave

6 June 2012

byNews Desk

EM Microelectronic Announces the EM9301, the World’s Lowest Voltage Bluetooth Low Energy Controller

• Communications

6 June 2012

byNews Desk

Agilent Technologies Accelerates Early Wireless Design Verification with New Release of SystemVue

• Design

6 June 2012

byNews Desk

TI power converter conserves energy in smart meter and sensor designs

• Power

6 June 2012

byNews Desk

Synopsys Launches Industry’s First Integrated Hybrid Prototyping Solution

• Design

6 June 2012

byNews Desk

New reference designs enhance embedded function block of Lattice MachXO2 PLD Family

• Design

6 June 2012

byNews Desk

Advantest Announces 3D TSV Stack Test Solutions

• Test & Measurement

6 June 2012

byNews Desk

Advantest Announces Memory Test System T5811

• Test & Measurement

6 June 2012

byNews Desk