Products news from Electronic Specifier

Popular Searches

Trending Now

The next mode of transformation: 3D IC integration

ES Blog

16 September 2026

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME’s offer

14 September 2026

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

24 August 2026

Cadence Tensilica IP powers Analog Devices’ DSP architecture

Cadence Tensilica IP powers Analog Devices’ DSP architecture

Cadence Tensilica IP powers Analog Devices’ DSP architecture

20 September 2026

ROHM launches a MOSFET with industry-leading Wide-SOA

ROHM launches a MOSFET with industry-leading Wide-SOA

ROHM launches a MOSFET with industry-leading Wide-SOA

20 September 2026

Raising the bar for interconnect performance in military aircraft

Raising the bar for interconnect performance in military aircraft

Raising the bar for interconnect performance in military aircraft

19 September 2026

What are You Looking For?

Popular Searches

Trending Now

The next mode of transformation: 3D IC integration

ES Blog

16 September 2026

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME's offer

Raytac Bluetooth Low Energy modules in TME’s offer

14 September 2026

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

Too cool to drift: how thermal engineering is redefining system stability

24 August 2026

Cadence Tensilica IP powers Analog Devices’ DSP architecture

Cadence Tensilica IP powers Analog Devices’ DSP architecture

Cadence Tensilica IP powers Analog Devices’ DSP architecture

20 September 2026

ROHM launches a MOSFET with industry-leading Wide-SOA

ROHM launches a MOSFET with industry-leading Wide-SOA

ROHM launches a MOSFET with industry-leading Wide-SOA

20 September 2026

Raising the bar for interconnect performance in military aircraft

Raising the bar for interconnect performance in military aircraft

Raising the bar for interconnect performance in military aircraft

19 September 2026

Home Products Page 107

Understanding the role of AI in network infrastructure

Artificial Intelligence

27 June 2025

300V rad-hard GaN FET for higher voltage satellite power systems

Power

27 June 2025

New Xsens Avior OEM IMU offers high accuracy and stability

Test & Measurement

27 June 2025

First 10GBASE-AU enabled camera with optical fibre connectivity

Cables/Connecting

27 June 2025

Powell Electronics stocking Amphenol Tri-Start MIL-DTL-38999 Series III connectors

Cables/Connecting

27 June 2025

Matter LED drivers deliver smart lighting

Power

27 June 2025

NIR LEDs range expanded with compact top-view types

Displays

27 June 2025

NEXT Biometrics launches FAP 30 fingerprint sensor

Sensors

26 June 2025

Virtium Embedded Artists launches first SOM to include on-board hardware AI accelerator chip

Artificial Intelligence

26 June 2025

Chalmers researchers develop highly efficient amplifier

Quantum Tech

26 June 2025

IAR upscales embedded software dev workflows for Renesas MCU architectures

Tools

25 June 2025

Rutronik expands portfolio with Vishay capacitors

Passives

25 June 2025

Understanding power distribution networks: challenges and tools for mastering the design quest

Understanding power distribution networks: challenges and tools for mastering the design quest

Understanding power distribution networks: challenges and tools for mastering the design quest

Design

25 June 2025

TDK-Lambda GENESYS series expanded

Power

25 June 2025

1.3kW fully digital, configurable, modular AC/DC power supply

1.3kW fully digital, configurable, modular AC/DC power supply

1.3kW fully digital, configurable, modular AC/DC power supply

Power Supplies

25 June 2025

ROHM launches an isolated gate driver IC for GaN devices

Passives

25 June 2025

Siemens targets design with GenAI

Tools

25 June 2025

xMEMS announces µCooling fan-on-a-chip solution for XR smart glasses

xMEMS announces µCooling fan-on-a-chip solution for XR smart glasses

xMEMS announces µCooling fan-on-a-chip solution for XR smart glasses

Wearables

25 June 2025

Siemens streamlines design of integrated 3D ICs

Design

25 June 2025

HPE unveils new AI factory solutions built with NVIDIA

Artificial Intelligence

25 June 2025