Package types include micro-channel cooled stacks, conduction cooled arrays, high brightness fiber coupled units and next generation heat sinks. An overview of diode laser capabilities will be presented to include a rated 600+W conduction cooled 200 micron core, 0.22 NA fiber coupled package, a 2kW 400 micron core, 0.22NA fiber coupled unit, tapered lasers, diodes emitting beyond 2.1 microns, and next generation designs.
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