Vishay’s Ceramic Package Bases for High-Power LED Devices Offers Ultra-Low Thermal Resistance Down to 3 K/W

Optimized for high-power LEDs and laser diodes in automotive, industrial, and home applications, LSUB devices are designed to minimize the thermal resistance between the die and the package termination. The LSUB’s enhanced thermal design enables a lower junction temperature and increased efficiency and reliability compared to other technologies.

The LSUB series is available in two configurations: a standard configuration designed for conductive epoxy or and thick solder (greater than 12 µm) die attach methods, and an offset configuration designed for thin solder layers in the 2-µm to 3-µm range. The LSUB is designed to accommodate high-power LED die that are approximately 1 mm by 1 mm. The pad size of the standard configuration is large enough to accommodate a parallel diode for ESD protection.

The package bases are offered as singulated individual die or in square arrays. Additional LED configurations and form factors are available upon request. The LSUB is offered packaged in waffle packs or in wafer form for automatic die assembly.

Samples and production quantities of the new devices are available now, with lead times of seven to nine weeks for larger orders.