The TLP3480, TLP3481 and TLP3482 each have OFF-state output terminal voltage ratings and ON-state current ratings that are comparable to larger SOP-packaged devices – with these parameters ranging from 30V and 4.5A (for the TLP3480), 60V and 3A (TLP3481) to 100V and 2A (TLP3482). They also have low ON-resistance figures, due to incorporation of Toshiba’s proprietary trench MOSFET technology.
With 2.1×3.4mm (typ.) dimensions, the new P-SON4 package format presents a very small mounting area. This means the photorelays are well suited to high-density board mounting, where there is very limited space available. Their 7.2mm2 (typ.) mounting area is approximately 74% smaller than 2.54SOP4 and 84% smaller than 2.54SOP6 package types.
These highly compact photorelay devices are intended for use in a wide variety of measuring equipment and instrumentation – with semiconductor testers, probe cards and I/O interface boards among the key applications deriving benefits.