“As next generation packaging shrinks in size, conventional bulk technology becomes more of a design constraint due to its large package size,” said Andrew Dereka, Laird Technologies Product Manager. “Thin film technology provides our customers with more flexibility to optimize package design and keep optics stable in temperature fluctuating environments.”
The thin film eTEC TEMs have heat pumping densities ranging from 75 to 90 W/cm2 at an ambient temperature of 25°C. The new models include:
• HV14,18,F0,0101,GG – 1.4 Watts in 1 mm2
• HV37,48,F2,0202,GG – 3.7 Watts in 6.9 mm2
• HV56,72,F2,0203,GG – 4.8 Watts in 10.2 mm2
Constructed with Bismuth Telluride thin film technology and thermally conductive Aluminum Nitride ceramics, the eTEC Series is designed for higher voltage and lower, sub 10 Watt heat pumping applications. Other features include RoHS compliance, pending Telcordia Compliance and gold metallization for solder ability to mating substrate surfaces. As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets.