Optoelectronics

MPPCs incorporate through-hole electrodes

15th August 2016
Daisy Stapley-Bunten

The range of Multi-Pixel Photon Counters (MPPC); the S13360-VE series has been introduced by Hamamatsu Photonics. These COB package type MPPCs incorporate through-hole electrodes called TSV (Through-Silicon Via). This process optimises the available space between the sensitive area and the package edge (0.2mm on the four sides), allowing for a four-sided buttable arrangement.

The VE series is available with photosensitive areas of 2x2mm, 3x3mm and 6x6mm, each with a 50μm pixel pitch. Features include reduced crosstalk (compared to previous MPPCs) and crosstalk occurrences have been reduced from 44 to just 3%, while after pulsing affects are minimal. In addition, the dark count has been dramatically reduced, compared to previous detectors, to 0.5Mcps.

The S13360-VE series is optimised for a variety of applications, particularly those involving very low light-level detection. Other example applications include high-energy particle detection and medical imaging.

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