The LEDs provide scalable lighting design for compact spaces in one of the smallest form factors possible. The light-emitting surface is contacted within the component itself without the need for bond wires.
The lack of bond wires — combined with the small form factor and automotive-grade flip chip die, which allows directional light to exit only from the top surface of the LED package — enables tighter LED clusters and outstanding flexibility in creating custom lighting solutions.
The LEDs have a typical luminous flux of 10lm at 350mA, a colour temperature range of 2700K to 5000K, and a colour rendering index (CRI) of 80, with CRI 90 coming soon.
The number of individual LEDs, their arrangement and the relative proportions of warm white and cold white LEDs can be tailored to meet specific lighting requirements.