Optoelectronics

LED COB with low thermal resistance uses patented 3-pad LED technology

16th November 2015
Jordan Mulcare
0

Flip Chip Opto announces the Apollo 1200 Chip On Board (COB), a high performance LED module. Based on Flip Chip Opto’s patented 3-Pad LED Flip Chip and Pillar MCPCB technologies, both junction temperature and thermal decay are minimised due to its extremely low 0.006°C/W thermal resistance, allowing over 120,000lm to be emitted from a single LED COB module.

The Apollo 1200 high performance COB modules enable energy-efficient LED technology to replace metal halide lamps in extremely high power lighting applications such as high mast, stadium lighting, airport and shipping terminal lighting, maritime lighting and more.

Flip Chip Opto's patented 3-Pad Flip Chip and Pillar MCPCB technologies enable Apollo 1200 to perform high power lighting with extremely low thermal resistance. Unlike conventional LED modules that must dissipate LED heat through MCPCB’s thermal-resistant dielectric layer, Flip Chip Opto’s 3-Pad technology creates an extra thermal pad beside two electrode pads, and uses it to couple the heat directly from LED into the metal core of the underlying MCPCB. This innovation results in incredibly low thermal resistance that enables the feasibility of brighter output, less thermal decay, longer service life and the coordination with smaller heatsink.

The incredible thermal performance allows the Apollo 1200 to achieve the lumen output between 107,080 and 121,680lm at 1200W depending on the choice of colour temperature (CCT) and colour rendering index (CRI). Such unparalleled brightness from a single LED COB enables LED lighting to penetrate into the high power/wattage market including applications such as high mast lighting, stadium lighting, airport and shipping terminal lighting, maritime lighting and more.

Lower thermal resistance presented by the 3-Pad technology not only minimises the thermal decay but also boosts the brightness by allowing more driving current while still maintaining LED junction temperature (Tj) below its thermal threshold. Compared to conventional wire-bonded COBs, Apollo 1200 of 3-Pad technology is able to sustain higher driving current with minimal Tj increase and therefore produce more light under the same Tj restriction. Meanwhile, lower thermal resistance also exhibits the opportunity to coordinate with a smaller heatsink that represents less cost in material and shipping/handling.

Apollo 1200 is manufactured with a Light Emitting Surface (LES) of 90mm to generate powerful, smooth and evenly distributed lighting from a single LED COB. Standard CCT values include 2700, 3000, 4000, 5000 and 5700K along with CRI value as 70+, 80+, 90+ and 95+. In addition, 95+ of R9 and R12 are also available upon request.

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