Optoelectronics

Laser direct structuring enhances design flexibility

26th November 2014
Barney Scott
0

FCT Assembly announces that its A-Laser Division will discuss its Laser Direct Structuring (LDS) capability in Booth 235 at the BIOMEDevice Show, scheduled to take place 3rd to 4th December at the San Jose Convention Center, California. The introduction of LDS has revolutionised the moulded interconnect device market, bringing flexibility to design and enhancing product capability.

There are often three components to the development process involved in manufacturing LDS 3D circuits. Prototypes are developed with LPKF’s proprietary proto-paint process in combination with a raw part from virtually any plastic.

Next, the manufacturing industry has seen a number of innovations in the realm of 3D printed parts through advancements in materials and printing technology. Due to the quick-turn nature of this process, cycle times can be greatly reduced in the development phase.

Lastly, mould-injected parts, from LDS grade materials, can be brought to full-scale production.

From prototypes to production, A-Laser guides customers through the entire project. The engineering department excels in design, while also keeping in mind process implementation and cost reduction goals.

LPKF has also created a design guide allowing optimisation opportunities from the onset.

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