MACOM’s Etched Facet Technology (EFT) lasers are attached to the Silicon PIC using its proprietary Self-Alignment process (SAEFT™) with high coupling efficiency, offering a power efficient solution at reduced manufacturing cost.
MACOM’s MAOP-L284CN features four high bandwidth Mach-Zehnder modulators integrated with four lasers (1270, 1290, 1310, and 1330 nm) and a CWDM multiplexer, with each channel operating at up to 28 Gb/s. The L-PIC operates on a standard single mode optical fiber and includes integrated tap detectors for fiber alignment, system initialisation and closed loop control. A single fiber aligned to the output edge coupler of this 4.1×6.5mm die is the only optical requirement for implementing this device into QSFP28 transceiver applications. MACOM is also offering the MASC-37053A modulator driver integrated with CDR, matched with this L-PIC for optimised performance and power dissipation.
“Silicon-based photonic integrated circuits, or PICs, enable integration of optical devices such as modulators and multiplexer onto a single chip. We believe that MACOM’s L-PIC solves the key challenge of aligning lasers to the silicon PIC with high yield and high coupling efficiency, making the adoption of Silicon PICs a reality for high-speed optical interconnects within the datacentre,” said Vivek Rajgarhia, Vice President of Strategy, High-Speed Networking, MACOM.
MACOM’s L-PIC will be on display for private demonstrations at OFC 2016, Booth #3101, March 22-24th in Anaheim, CA. To make an appointment, contact your local sales representative.