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Increase surface area contact between component & heat sink

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Home Products Optoelectronics Increase surface area contact between component & heat sink

Increase surface area contact between component & heat sink

One of the most challenging issues when using LEDs is thermal dissipation. These lighting packages typically generate a significant amount of heat. If it is not managed correctly, this can severely limit the efficiency, output and useful life of the LED. One of most common ways to remove this performance-hindering byproduct is to use a heat sink.

Optoelectronics

26 August 2015

byNews Desk

To maximise cooling performance, Fujipoly offers a full line of extremely soft, Sarcon GR-ae thermal interface materials. These gap filler pads dramatically increase surface area contact between the component and heat sink.

The cost-effective silicone based material is available in nine thicknesses that deliver a thermal conductivity of 1.3W/m°K with a thermal resistance as low as 0.50°Ccm²/W. Sarcon GR-ae is available in pre-cut sheets up to 200x300mm or can be die-cut to fit your exact application specifications.