Potential applications include factory automation, Battery Management Systems (BMS), telecommunication equipment and the IoT.
The photorelays utilise multi-chip technology and were developed as high specification, pin-compatible versions of Toshiba’s existing 2.54SOP package products, the TLP172A and TLP172G. A double-mould structure improves minimum voltage isolation to 3750VRMS against the 1500VRMS of existing products.