Mouser Electronics, announces a new eBook, in collaboration with Analog Devices, (ADI) and Molex, that explores the forefront of miniaturisation trends shaping our future.
Across nearly all industries, engineers are being asked to deliver more compact designs for a wide range of purposes. Whether they are wearables for consumers and healthcare, instrumentation advances, or industrial automation solutions, systems are expected to occupy less space and consume less power without sacrificing performance or reliability. In 11 experts on Miniaturised Electronics Design and Applications, engineers from ADI, Molex, and other companies discuss the many challenges designers face while working towards system miniaturisation. The eBook also highlights several products, available at Mouser, that both ADI and Molex offer to support this transition through advances in integration, packaging, and interconnect design.
The EVAL-ADAQ4224-FMCZ evaluation board, available from Mouser, provides a demonstration and development platform for ADI’s ADAQ4224 μModule Data-Acquisition (DAQ) System-in-Package (SiP) solution. The ADAQ4224 DAQ integrates the critical passive components required in a data acquisition solution into a single component, using ADI’s iPassives technology, minimising temperature-dependent error sources and offering optimised performance.
The EVAL-AD3530RARDZ evaluation board enables prototyping with ADI’s AD3530 and AD3530R Digital-to-analogue converters (DACs). The AD3530 and AD3530R DACs include integrated multiplexers that facilitate monitoring of output voltages, currents, and internal die temperature. The devices incorporate power-on reset (POR) circuits that ensure the DACs output power up to and present at 32kΩ to ground until a valid write is executed. The AD3530R also offers a 2.5V, 5ppm/°C internal reference that is disabled by default.
The Quad-Row board-to-board connectors from Molex feature a staggered circuit layout and a 0.175mm pitch low-profile design for 30% space savings over conventional connectors. These patent-pending connectors offer product developers and device manufacturers greater freedom and flexibility to support compact form factors, making them ideal for augmented reality/virtual reality automotive, communications, IoT, and other space-constrained applications.
The Molex Easy-On FFC/FPC Connectors are ideal for tight packaging applications and offer an overall compact size for maximum space savings, along with contact assurance and easy operation. These connectors are provided in pitch sizes from 0.20 to 2.00 mm, circuit sizes from 2 to 96, and with actuator types that include front flip, back flip, slider, one-touch and low-insertion force, in a right-angle or vertical orientation.
