The new DAC, offering Line and Headset outputs, meets the increasing demand for higher audio quality from mobile music applications and is ideal for any mobile phone platform where audio quality needs to be boosted to a Hi-Fi level. Easy system implementation, minimum bill of materials (BOM), and a very small footprint are ensured by integrated power management, which eliminates the need for an external voltage regulator, and by the built-in 50mW ‘true-ground’ headset amplifier, which operates without coupling capacitors.
The STw5200 extends ST’s audio DAC and ADC family, with enhanced audio performance. The device’s high level of integration is made possible by ST’s leading-edge 0.13-micron analog CMOS process.
Samples of the STw5200 are available now to lead customers, with volume production planned for March 2008. The chip is packaged in a 4 x 4 x 1.2mm TFBGA40, with 0.5mm ball pitch, and a 7 x 7 x 1mm VFQFPN44, with 0.5mm pitch. A 2.6 x 2.6 x 0.65mm WLCSP36 packaged version, with 0.4mm ball pitch, is planned for introduction in Q3 2008.