Top 5 micro products in May
Electronic Specifier takes a look at the top 5 micro products to have been released in May 2023.
Cambridge GaN Devices release new Application Interface Boards
Cambridge GaN Devices (CGD) has introduced a range of Application Interface Boards that allow designers to try out the company’s rugged, easy-to-use ICeGaN HEMTs in existing circuits in place of competing MOSFET or GaN devices without having to re-layout the PCB.
Application Interface Boards are adaptor PCBs that are soldered to an ICeGaN device, which map each pin/signal from the ICeGaN HEMT footprint to the corresponding pins/signals of an alternative component footprint. (Read more.)
Navitas' next-gen SiC Power Semis adopted in industrial chargers
Navitas Semiconductor announced that Exide Technologies' next-generation, high-frequency fast chargers for industrial material handling equipment have adopted new GeneSiC power semiconductors.
Exide Technologies is provider of battery storage solutions for the industrial and automotive markets. Exide's comprehensive range of lead-acid and lithium-ion solutions serves various applications, including traction batteries and charging solutions for material handling equipment and robotics, maximising fleet uptime with minimised total cost of ownership. (Read more.)
TriLite adds TDK as MEMS partner for the world’s smallest projection
TriLite welcomes TDK as the newest member of its growing manufacturing partner ecosystem.
TDK, a global specialist in electronic solutions for the smart society, will provide tiny MEMS mirrors for TriLite’s Trixel 3 laser beam scanner (LBS), the world’s smallest projection display. (Read more.)
Keysight enables advanced pre-tapeout silicon prototyping
Keysight Technologies have released a new Universal Signal Processing Architecture (USPA) prototyping platform, enabling semiconductor companies to conduct complete chip prototyping and verification, pre-tapeout, in a real-time development environment integrating digital twins of fully-compliant, standards-based signals.
The final step of the chip design process, known as the silicon tapeout, is an increasingly expensive procedure that leaves little room for design failure. If a design fails following the tapeout, chip makers must start over again with a new "re-spin" that can take 12 months or longer to complete. In addition to tying up valuable research and development resources, these chip redesigns can potentially cause the chip maker to miss a narrow time-to-market window. (Read more.)
MCUs bridge gap between 8-16MHz and high-end 32-bit devices
In stock at distributor Mouser Electronics is the STM32C0x Arm Cortex-M0+ 32-bit microcontrollers from STMicroelectronics.
The STMicroelectronics STM32C0x microcontrollers implement a high-performance Arm Cortex-M0+ 32-bit RISC core operating at up to 48 MHz. The devices provide a high level of integration, ideal for a wide range of consumer, industrial, and appliance applications. Additionally, the MCUs are prepared for the Internet of Things (IoT) solutions. (Read more.)