The ST23YS02 and ST23YS08 integrate 2 and 8 Kbytes of EEPROM, respectively. Competitive pricing, aided by their 0.13-micron manufacturing process, makes them ideal for a range of finance applications, but particularly for EMV migration from magnetic stripe to SDA (Static Data Authentication) Chip and PIN cards. A simplified architecture makes them easy to use to further reduce costs for code developers.
Both MCUs embed an eDES (enhanced DES) accelerator and support AES (Advanced Encryption Services) cryptography, and are certified to meet current EMVCo requirements. They provide ISO and IART interfaces, with planned additions to the family including crypto-processor and contactless products.
“ST’s new 0.13-micron family builds on more than 20 years experience in the design and manufacture of secure products for the banking industry, and is supported by our expertise in advanced non-volatile memories,” said Marie-France Florentin, ST’s Smartcard ICs Business Director. “Incorporating the security improvements developed over the last two years, the first small-memory devices in the family offer highly cost effective solutions for SDA migration and loyalty cards.”
Samples of the ST23YS08 will be available from September 2007, with volume production planned for November; the ST23YS02 will sample in December 2007 and will be available in volume from January 2008. Both devices are supplied in wafer form or as micro-modules.
